| 摘要 |
PURPOSE: Substrate bonding apparatus and substrate bonding method are provided to align two substrates although an alignment mark formed on one substrate is screened by the other substrate. CONSTITUTION: A substrate bonding apparatus includes a first stage, a second stage and a photography unit. The substrate bonding apparatus aligns a first substrate (40) having a first alignment mark formed and a second substrate (50) having a second alignment formed and bonds the two substrates. The first substrate is fixed to a first stage. The second substrate is fixed to the second stage and a third alignment mark is formed in the second stage. A photography unit photographs the first alignment mark, second alignment mark and third alignment mark. |
