| 摘要 |
PROBLEM TO BE SOLVED: To simplify formation of a constitution for ensuring electrical insulation in the constitution where a die pad is exposed from a package.SOLUTION: A semiconductor device 11 comprises: one lead terminal on the left edge side of the semiconductor device 11, which functions as a high-voltage lead terminal 16A of high potential (e.g. 700 V); a coating part 18 for coating a range of an undersurface of the die pad 15, which is located at a predetermined distance from the high-voltage terminal 16A, with a mold resin layer 14 integrally; and a concave part 15a which is preliminarily formed on the side of the undersurface of the die pad 15 for forming the coating part 18 and has a thickness thinner than the other part of the undersurface. The coating part 18 is formed by filling a mold resin into a clearance between a mold surface and an undersurface of the concave part 15a. |
