| 摘要 |
<p>Provided is a power converter that reduces manufacturing costs, and that enables an increase in the deformation strength of heat-transfer supporting metal sheets during transportation. The power converter is provided with: a semiconductor power module (11) on which a heat dissipating member (13) is formed on one surface of a case (12); a cooling body (3) joined to the heat dissipating member; mounting boards (22, 23) on which circuit components including heat generating circuit components are mounted; and heat-transfer supporting metal sheets (32, 33) which support the mounting boards at a prescribed distance from the semiconductor power module, and which are in contact with the cooling body so that the heat emitted from the mounting boards to the cooling body is dissipated without passing through the housing. An accommodation part (18), in which heat-transfer supporting metal sheets (32c, 33c) are accommodated, is formed on the outer peripheral side of the joined surface of the heat dissipating member.</p> |
