发明名称 RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition from which a pattern can be formed to satisfy demands for high sensitivity, high resolution (for example, high resolving power, superior pattern features and small line edge roughness (LER)) and good dry etching durability, and to provide an actinic ray-sensitive or radiation-sensitive film using the composition, a mask blank in which the above film is formed, and a pattern forming method.SOLUTION: The resin composition contains a polymeric compound (A) having a repeating unit (Q) expressed by general formula (1). In the formula, Rrepresents a hydrogen atom, a methyl group or a halogen atom; Rand Rrepresent a hydrogen atom, an alkyl group or a cycloalkyl group; L represents a divalent connecting group or a single bond; Y represents a substituent excluding a methylol group; Z represents a hydrogen atom or a substituent; m represents an integer of 0 to 4; and n represents an integer of 1 to 5, where m+n is at most 5.
申请公布号 JP2014024999(A) 申请公布日期 2014.02.06
申请号 JP20120167509 申请日期 2012.07.27
申请人 FUJIFILM CORP 发明人 TSURUTA TAKUYA;TSUCHIMURA TOMOTAKA;IWATO KAORU
分类号 C08F12/22;C08F20/30;G03F7/004;G03F7/038;G03F7/039;H01L21/027 主分类号 C08F12/22
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