METHOD FOR MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD AND SOLDER JOINT PART, AND PRINTED WIRING BOARD WITH CONNECTION LAYER AND SHEET-LIKE JUNCTION MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component that can decrease the number of processes.SOLUTION: There are provided a method for mounting an electronic component where while a connection layer comprising a conductive layer (α) formed of a solder powder-containing resin composition including a thermosetting resin (a1), solder powder (a2), and a reducer (a3), and one or two thermoplastic resin layers (&bgr;) formed of a thermoplastic resin is provided between a printed wiring board 10 and an electronic component 60, the electronic component 60 is connected to a wiring and mounted; a circuit board 100 manufactured by the method for mounting an electronic component and a solder joint part 80; and a printed wiring board with a connection layer and a sheet-like junction member.