METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board which can increase a contact area with an insulating layer thus solving separation problems of the circuit pattern, minimizing generation of damage to the circuit pattern due to undercutting, and achieving a fine circuit pattern.SOLUTION: A method of manufacturing a printed circuit board comprises: forming a trench 110 in a negative shape on an insulating layer 100; forming a plating resist pattern 130; forming a circuit pattern 150; and removing the plating resist pattern 130.