| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate which can sufficiently improve a connection reliability of an electronic component having terminals formed at a narrow pitch and a method for manufacturing the same.SOLUTION: A method for manufacturing an electronic component built-in substrate 2 in which electronic components 50, 51 are embedded includes the steps for: simultaneously forming a through hole and holes which serve as alignment marks 61, 63 on a metal plate which is a precursor of a core member 6; placing a core member 6 on an uncured first resin layer 21; placing the electronic components 50, 51 on the uncured first resin layer 21 so that terminals 52 of the electronic components 50, 51 come into contact with a first resin layer 21; curing the uncured first resin layer 21; providing an uncured second resin layer 31 on the cured first resin layer 21, the core member 6, and the electronic components 50, 51; and curing the uncured second resin layer 31. |
