METAL BASE PRINTED WIRING BOARD

摘要

Provided is a highly heat-conductive printed wiring board, which is capable of eliminating generation of electrochemical migration by suppressing elution of copper ions. This metal base printed wiring board is provided with a base metal plate having a resin insulating layer and a copper foil layer sequentially laminated thereon. The resin insulating layer includes a first inorganic filler composed of inorganic particles having an average particle diameter (D50) of 1-300 nm, and a particle diameter of 0.1-600 nm, and a second inorganic filler composed of inorganic particles having an average particle diameter (D50) of 500 nm to 20 mum, and a particle diameter of 100 nm to 100 mum, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the resin insulating layer.