SEMICONDUCTOR PACKAGE CONTAINING SILICON-ON-INSULATOR DIE MOUNTED IN BUMP-ON-LEADFRAME MANNER TO PROVIDE LOW THERMAL RESISTANCE

摘要

Thermal transfer from a silicon-on-insulator (SOI) die is improved by mounting the die in a bump-on-leadframe manner in a semiconductor package, with solder or other metal bumps connecting the active layer of the SOI die to metal leads used to mount the package on a printed circuit board or other support structure.