| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder ball mounting mask capable of improving stability of a device, a solder ball mounting device, a solder ball mounting system including the same, and a solder ball mounting method using the same.SOLUTION: The solder ball mounting device according to the present invention includes: a table 100 on the upper face of which a printed circuit board 110 is mounted; a mounting mask 200 having respective openings 210 corresponding to respective pads of the printed circuit board 110, and overlaid and mounted on the table 100 via the printed circuit board 110; and squeezers 310, 320 provided on each side of the upper face of the mounting mask 200, and squeezing multiple solder balls in one direction. The openings 210 have sizes different from each other according to diameters of the solder balls. |
