| 摘要 |
PROBLEM TO BE SOLVED: To reduce possibility of occurrence of poor connection between an IC chip and an antenna pattern, when a load is applied to a connection part between the IC chip and the antenna pattern.SOLUTION: A through-hole 35 penetrating antenna base material 30 is disposed on a connection area 33 where an IC chip 10 and an antenna pattern 32 are connected by a silver paste adhesive agent 40b. The silver paste adhesive agent 40b for connecting the IC chip 10 and the antenna pattern 32 is entered into the through-hole 35. |
