发明名称 LASER PROCESSING SYSTEM, AND LASER PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser processing system and laser processing method that can perform laser processing on a work at a high speed with high definition and that makes it possible to achieve a reduction in costs and a compact design.SOLUTION: In a laser processing method employing a laser processing system 10, first laser light LB1 emitted from a first concentration optical system 16 formed so that a focal length thereof can be varied, and second laser light LB2 that is emitted from a second concentration optical system 18 formed so that the focal length thereof can be varied and that has a wavelength different from that of the first laser light LB1 are coaxially superposed on each other by a dichroic mirror 20. Thereafter, a galvano-scanner 22 is used to scan a work W with the resultant light.
申请公布号 JP2014024105(A) 申请公布日期 2014.02.06
申请号 JP20120167979 申请日期 2012.07.30
申请人 MIYACHI TECHNOS CORP 发明人 NAGASHIMA TAKAHIRO
分类号 B23K26/046;B23K26/00;B23K26/06;B23K26/064;H01S3/00 主分类号 B23K26/046
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