| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component that has high bond strength with respect to a vibrating body layer and further has a conductive pad excellent in electrical connection.SOLUTION: A manufacturing method for a pressure sensor 1 that has a diaphragm layer 2 and a vibrating body substrate 3 having a vibrating body 31 and an exposed portion 321, with the vibrating body substrate 3 being configured in such a way that excitation electrodes 61 and 62 positioned on the vibrating body 31, conductive pads 63 and 64 positioned on the exposed portion 321, and wiring 65 and 66 connecting the excitation electrodes 61 and 62 and the conductive pads 63 and 64 are formed thereon, includes the steps of: preparing the diaphragm layer 2 and the vibrating body substrate 3 on which the excitation electrodes 61 and 62 and the wiring 65 and 66 led out to the exposed portion 321 are formed and bonding them together; and forming the conductive pads 63 and 64 on the exposed portion 321 such that parts of the conductive pads 63 and 64 overlap with the wiring 65 and 66. |
