| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can tightly connect an electrode of a semiconductor element with a semiconductor element connection pad.SOLUTION: In a wiring board 10 which includes an insulation substrate 1 covered with a conductor layer 2 and a solder resist layer 3 covering the insulation substrate 1 so as to cover a part of the conductor layer 2, and detects positional deviation between the conductor layer 2 and the solder resist layer 3 by overlapping a first positioning mark 5 provided on the conductor layer 2 and a second positioning mark 6 provided on the solder resist layer 3, the first positioning mark 5 has a first blank pattern 5p obtained by removal in an annular manner by a first width 5w, and the second positioning mark 6 has a second blank pattern 6p obtained by removal in an annular manner by a second width 6w. A first circle 5c formed by a center line of the first width 5w and a second circle 6c formed by a center line of the second width 6w have radiuses different from each other, and the first circle 5c and the second circle 6c are inscribed with each other when positional deviation reaches an allowable limit. |
