| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus which improves the connection reliability of a circuit board and enables formation of a thin shape, and to provide an attachment method of the circuit board.SOLUTION: An electronic apparatus according to one embodiment includes: a housing having a thick portion where a thickness is partially increased; an electronic component where another component is attached to a rear surface thereof; and a substrate having a through hole. The substrate includes: a front surface where the electronic component is attached thereto in a posture that another component enters the hole; and a rear surface which faces an internal surface of the housing so that the hole overlaps with at least a part of the thick portion. |
