| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having high reliability in encapsulation by an encapsulation resin.SOLUTION: A wiring board 10 comprises: a semiconductor element mounting part A1 for mounting a semiconductor element E and lead connection parts A2 for connecting lead terminals L, which are formed on a top face of an insulation substrate in which a second insulation layer 2 is stacked on a first insulation layer 1; a plurality of semiconductor element connection pads 3 formed on the first insulation layer 1 at parts just below the semiconductor element mounting part A1; openings 5 formed in the second insulation layer 2 for exposing the semiconductor element connection pads 3; and lead connection pads 4 formed on the lead connection parts A2 in the second insulation layer 2. A top face of the second insulation layer 2 has arithmetic average roughness Ra at the semiconductor element mounting part A1 of 50-80 nm and at the lead connection part A2 of 100-150 nm. |
