| 摘要 |
PROBLEM TO BE SOLVED: To provide a process of manufacturing an electrode for a charged particle beam lens provided with a through-hole having the processing accuracy required for an electrostatic type charged particle beam lens used for a charged particle beam exposure apparatus.SOLUTION: The process of manufacturing a substrate for microstructure processing includes the processes of: manufacturing a first substrate; manufacturing a second substrate; manufacturing a third substrate; bonding the first substrate and the second substrate; communicating the opening of the second substrate with the outside by removing part of the second substrate; bonding the second substrate and the third substrate; and communicating each of the opening of the first substrate and the opening of the third substrate with the outside, respectively; wherein the thickness of a layer composed of a material whose etching resistance is higher than silicon to a silicon etchant which appears at the bottom of the first substrate is thicker than the thickness of a layer composed of a material whose etching resistance is higher than silicon to a silicon etchant which appears at the bottom of the second substrate. |
