发明名称 CURABLE RESIN COMPOSITION, METHOD FOR CURING SAME, AND SHEET MANUFACTURED THEREFROM
摘要 <p>Provided are a curable compound, a photoinitiator, and a curable resin composition comprising at least two thermal initiators having different initiation reaction temperatures. Since the curable resin composition can improve a curing rate while having a high conversion rate, the curable resin composition is suitable for manufacturing thick films.</p>
申请公布号 WO2014021521(A1) 申请公布日期 2014.02.06
申请号 WO2012KR11615 申请日期 2012.12.27
申请人 LG HAUSYS, LTD. 发明人 KIM, DONG KWAN;LEE, MIN HEE
分类号 C08F20/10;C08J5/18;C08J7/04;C08L33/04 主分类号 C08F20/10
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