发明名称 LOW THERMAL DISTORTION SILICON COMPOSITE MOLDS
摘要 The present invention provides compositions and methods that may be used to form low thermal distortion molds. The composition may include a curable elastomeric silicone composition formed using a de-volatilized polymer and at least one de-volatilized cross-linker. One embodiment of the method may include forming a pattern on a first side of an elastomer that is impregnated with a fibrous material proximate a second side of the elastomer.
申请公布号 KR101358066(B1) 申请公布日期 2014.02.06
申请号 KR20087027634 申请日期 2007.03.09
申请人 发明人
分类号 B29C33/38;C08L83/04;C08L83/07;G03F7/00 主分类号 B29C33/38
代理机构 代理人
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