| 摘要 |
1,186,974. Semi-conductor devices. HUGHES AIRCRAFT CO. 24 May, 1968 [25 May, 1967], No. 25025/68. Heading H1K. An integrated circuit (T.C.) having bonding pads arranged in a first pattern is adapted for mounting on a substrate having conductors arranged in a second, different, pattern by providing the I.C. with overlying conductors connecting the first bonding pads to further bonding pads arranged in a second pattern matching that of the substrate conductors. As shown, Fig. 6, a silicon I.C. 2 (for example a shift register) having conductive tracks and bonding pads 8 overlying a silicon dioxide layer is adapted for mounting on a printed circuit by depositing a layer 14 of glass over the surface, forming apertures exposing part of each bonding pad 8, vapour depositing aluminium over the surface, and photo masking and etching to produce conductive leads forming enlarged bonding pads 18 connected to the original bonding pads 8. The new bonding pads are disposed so that the I.C. can be mounted directly on the printed circuit. The bonding pads 18 may be provided with solder bumps 24<SP>1</SP> by electroplating, or alternatively such a bump may be provided on the conductors of the printed circuit. The bonding pads may be connected to the printed circuit conductors by ultrasonic bonding. A plurality of I.C.s may be mounted on a single printed circuit which can then be encapsulated in epoxy resin or mounted in a hermetically sealed package. The glass layer may be sputtered on to the surface of the I.C. and the apertures formed by photomasking and etching. Alternatively, areas of polymeric material (photoresist) may be provided on the bonding pads and the layer of glass vapour deposited or sputtered over the surface. The apertures may then be formed either by dissolving the polymeric material to loosen the overlying glass, or by heating to further polymerize and preferably charr the polymeric material causing it to expand and thus force off the overlying glass. |
