| 摘要 |
A microelectronic package (10) includes first and second encapsulated microelectronic elements (14,16), each includes a semiconductor die (14) having a front face (20) and contacts (26). An encapsulant (28) contacts an edge surface (24) of each die and extends in at least one lateral direction therefrom. Electrically conductive elements (36) extend from the contacts and over the front face to locations overlying the encapsulant. The first and second microelectronic elements are affixed to one another such that one of the front or back surfaces of one of the first and second dies is oriented towards one of the front or back surfaces of the other of the first and second dies. A plurality of electrically conductive interconnects (40) extend through the encapsulants of the first and second microelectronic elements and are electrically connected with at least one semiconductor die of the first and second microelectronic elements by the conductive elements. |
