发明名称 |
MULTILEVEL INTERCONNECT STRUCTURES AND METHODS OF FABRICATING SAME |
摘要 |
A multilevel interconnect structure for a semiconductor device includes an intermetal dielectric layer with funnel-shaped connecting vias. The funnel-shaped connecting vias are provided in connection with systems exhibiting submicron spacings. The architecture of the multilevel interconnect structure provides a low resistance connecting via. |
申请公布号 |
US2014035159(A1) |
申请公布日期 |
2014.02.06 |
申请号 |
US201314048295 |
申请日期 |
2013.10.08 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
DI FRANCO ANTONIO;BONIFACIO MARCO;CRISTOFALO SILVIO |
分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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