| 摘要 |
A packaged integrated device can include a die attach pad having a top surface and a bottom surface. A plurality of leads physically and electrically separated from the die attach pad can be positioned at least partially around the perimeter of the die attach pad. An integrated device die can be mounted on the top surface of the die attach pad. A package body can cover the integrated device die and at least part of the plurality of leads, and at least a portion of the bottom surface of each of the plurality of leads can be exposed through the package body. A plating layer can cover substantially the entire width of an etched lower portion of the outer end of each lead and at least the exposed portion of the bottom surface of each lead. |
