SPUTTERING TARGET FOR FORMING Cu ALLOY THIN FILM, AND METHOD FOR MANUFACTURING SAME

摘要

Provided is a sputtering target used for forming a Cu-Mn alloy thin film useful as, for example, an electrode film for a display device such as a liquid crystal display, wherein the number of abnormally coarse cluster particles during sputtering is reduced and generation of particles and splashes is minimized. Also provided is a method for manufacturing the sputtering target. This sputtering target for forming a Cu alloy thin film is a Cu alloy sputtering target containing at least Mn at an amount of 2-20 atom%, the Vickers hardness in a t/2 cross-section in the thickness direction of the sputtering target being controlled to 50-100 HV.