| 摘要 |
<p>Provided is a substrate bonding apparatus with which high-precision bonding, using adhesive, between a concave substrate having a concave face and a flexible, thin substrate can be achieved. Said apparatus is provided with a central block (41) and separated blocks (42), both sides of which are separated by the central block (41), and the separated blocks (42) have, on the side edge part (20b) of a concave substrate (20) side, a pressing-bending face (42a) which has essentially the same shape as a concave face (20a) portion of said side edge part (20b). The separated blocks (42) move between a first position (A) close to the central block (41) and a second position (B) in contact, by way of the thin substrate (21), with the side edge part (20b) of the concave substrate (20). When the separated blocks (42) move into the first position (A), the central block (41) and the separated blocks (42) are contracted so as to be smaller than the concave face space (20c) of the concave substrate (20), and when the separated blocks (42) move into the second position (B), the separated blocks (42) the central block (41) and the separated blocks (42) expand to lie along the concave face (20a) of the concave substrate (20).</p> |
