发明名称 PREPREG WITH CARRIER AND PROCESS FOR MANUFACTURING SAME, MULTI-LAYERED PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE
摘要 <p>According to one aspect of the present invention, there is provided a prepreg with a carrier, comprising: a sheet-like base member; a first insulating resin layer provided to cover a surface of the sheet-like base member; a first carrier provided to cover the first insulating resin layer; a second insulating resin layer provided to cover a back surface of the sheet-like base member; and a second carrier provided to cover the second insulating resin layer, wherein the first and the second insulating resin layers have different resin compositions or the first and the second insulating resin layers have different thicknesses, and a front surface and a back surface of the prepreg with the carrier is visually identifiable.</p>
申请公布号 KR101359769(B1) 申请公布日期 2014.02.06
申请号 KR20097021016 申请日期 2008.03.24
申请人 发明人
分类号 C08J5/24;H05K1/02;H05K3/00;H05K3/46 主分类号 C08J5/24
代理机构 代理人
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