发明名称 COMPOSITE COMPOSITION OF A POLYIMIDE COPOLYMER AND INORGANIC PARTICLES, METHOD FOR MANUFACTURING THE SAME, MOLDED ARTIFACT INCLUDING THE SAME, AND DISPLAY DEVICE HAVING THE MOLDED ARTIFACT
摘要 PROBLEM TO BE SOLVED: To provide a composite composition of a polyimide copolymer and inorganic particles which has, apart from being excellent in terms of solvent solubility, workability, and optical characteristics and being capable of attenuating the thermal expansion coefficient, a high heat resistance and excellent mechanical strengths and which can be used favorably for manufacturing molded artifacts, above all for manufacturing films for display devices demanded to meet advanced heat resistance and transparency standards, a method for manufacturing the same, a molded artifact including the same, and a display device having the molded artifact.SOLUTION: Provided is a composite composition of a polyimide copolymer and inorganic particles including, as a copolymer comprising first repeating units or second repeating units including imide repeating units or amic acid repeating units forming imide repeating units as a result of imidation and third repeating units including amide repeating units, a copolymer in which at least one terminal thereof has been substituted with a substituted or un substituted siloxane or silanol group; and inorganic particles or precursors thereof.
申请公布号 JP2014025066(A) 申请公布日期 2014.02.06
申请号 JP20130157038 申请日期 2013.07.29
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 CHO CHUNG-KUN;KOVALEV MIKHAIL;KALININA FEDOSYA;DOMITRY ANDROSOV
分类号 C08L79/08;C08G73/14;C08K3/22;C08K3/36;C08K5/057;C08K5/5415 主分类号 C08L79/08
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