发明名称 BUILDING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To reduce a temperature change in an underfloor space by effectively using heat in the ground.SOLUTION: A building structure includes an underfloor space 5 enclosed by a foundation 2 and a floor 3. The foundation 2 is provided with a heat insulating material 8 which blocks heat transmitted from the outside of a building to the underfloor space 5. The underfloor space 5 is provided with a heat exchange part 21. The heat exchange part 21 includes an underground heat transmission part 23 formed of a material having excellent thermal conductivity. The underground heat transmission part 23 includes an outer underground heat transmission part 24 arranged on the foundation 2 side of the underfloor space 5, and an inner underground heat transmission part 25 arranged on the center side of the underfloor space 5. The lower end 24b of the outer underground heat transmission part 24 is located deeper in the ground than the lower end 25b of the inner underground heat transmission part 25.
申请公布号 JP2014025316(A) 申请公布日期 2014.02.06
申请号 JP20120168707 申请日期 2012.07.30
申请人 PANAHOME CORP 发明人 NAKAGAWA HIROSHI;NISHIO KAZUNORI;TADOKORO SOJI;SATO HIROSHI;UMEMOTO DAISUKE
分类号 E04B1/76;F24F3/00;F24F5/00;F24J3/08 主分类号 E04B1/76
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