| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure capable of accelerating filling of an encapsulation resin without influencing reliability and manufacturing cost of the device even when flip-chip bonding is used.SOLUTION: A semiconductor device 200 of the present embodiment comprises: a wiring board 201; first bump arrays 204a, 204b arranged adjacent to each other on one surface of the wiring board 201; semiconductor chips 203 mounted on the wiring board 201 via the first bump arrays 204a, 204b; an encapsulation resin 211 filled in a clearance between the wiring board 201 and the semiconductor chips 203; and second bump arrays 205a, 205b for guiding the encapsulation resin 211 toward the space between the first bump array 204a and the first bump array 204b between the wiring board 201 and the semiconductor chips 203. |
