发明名称 |
Elevated Photodiode with a Stacked Scheme |
摘要 |
A device includes an image sensor chip having formed therein an elevated photodiode, and a device chip underlying and bonded to the image sensor chip. The device chip has a read out circuit electrically connected to the elevated photodiode. |
申请公布号 |
US2014035083(A1) |
申请公布日期 |
2014.02.06 |
申请号 |
US201213671330 |
申请日期 |
2012.11.07 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WAN MENG-HSUN;CHU YI-SHIN;CHEN SZU-YING;CHEN PAO-TUNG;LIU JEN-CHENG;YAUNG DUN-NIAN |
分类号 |
H01L31/0216;H01L31/0224 |
主分类号 |
H01L31/0216 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|