发明名称 Elevated Photodiode with a Stacked Scheme
摘要 A device includes an image sensor chip having formed therein an elevated photodiode, and a device chip underlying and bonded to the image sensor chip. The device chip has a read out circuit electrically connected to the elevated photodiode.
申请公布号 US2014035083(A1) 申请公布日期 2014.02.06
申请号 US201213671330 申请日期 2012.11.07
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 WAN MENG-HSUN;CHU YI-SHIN;CHEN SZU-YING;CHEN PAO-TUNG;LIU JEN-CHENG;YAUNG DUN-NIAN
分类号 H01L31/0216;H01L31/0224 主分类号 H01L31/0216
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