| 摘要 |
The present invention relates to a substrate for a light emitting device, a module for the light emitting device, and a method for manufacturing the substrate for light emitting device capable of improving electrical, mechanical, thermal, and optical performances. The present invention comprises an insulating plate, a first conductive layer, a second conductive layer, a groove unit, and an interconnecting plating layer. The insulating plate comprises a first surface and a second surface in which the light emitting device is mounted. The first conductive layer is formed on the first surface of the insulating plate. The second conductive layer is formed on the second surface of the insulating plate. The groove unit is formed on the second surface of the insulating plate by penetrating the second conductive layer. The interconnecting plating layer comprises a part formed on the second conductive layer. The interconnecting plating layer is extended from the part to an inner surface of the groove unit and the first conductive layer exposed inside the groove unit. The interconnecting plating layer electrically connects the first conductive layer and the second conductive layer. |
