| 摘要 |
<p>Provided is a method for bringing a substrate into contact with a probe card in a substrate inspection apparatus, the method allowing effective inspection of electrical properties of a semiconductor device provided on the substrate. A wafer (W) is arranged on a chuck member (22) using a wafer plate (37) and transported to a position opposing a probe card (36). The transported wafer (W) is moved together with the wafer plate (37) toward the probe card (36) using a lifting device (43) to bring a plurality of electrodes on a semiconductor device provided on the wafer (W) into respective contact with a plurality of probes provided on the probe card (36). The wafer (W) is then caused to overdrive further toward the probe card (36), whereupon the space (S) between the probe card (36) and the wafer plate (37) is reduced to maintain contact between the electrodes of the semiconductor device and the probes of the probe card (36), and the chuck member (22) is removed from the wafer plate (37).</p> |
