<p>A rotary deposition target bonded to a backing tube such that the bonding material is applied only at the ends of the rotary sputtering target to form a gap between the rotary sputtering target and the backing tube to enable a target cooling fluid used during the deposition process to contact the target directly and to provide a hermetic seal to contain the cooling fluid within the gap and prevent the fluid from being exposed to the environment within the deposition chamber.</p>
申请公布号
WO2014022288(A1)
申请公布日期
2014.02.06
申请号
WO2013US52519
申请日期
2013.07.29
申请人
MATERION ADVANCED MATERIALS TECHNOLOGIES AND SERVICES INC.