CURABLE COMPOSITION, CURED PRODUCT AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a curable composition allowing low dielectric constant and low dielectric tangent of a cured product and being excellent in heat resistance and fire retardancy; a cured product obtained by curing this; and a printed wiring board.SOLUTION: A curable composition is characterized by containing an epoxy compound (A) having a resin structure represented by the structural formula 1 and an active ester compound (B).