| 摘要 |
<p>Provided is a dicing sheet, which is provided with an adhesive layer, said adhesive layer being capable of exhibiting an excellent adhesiveness to the surface of a device-related part, in particular, even to an adherent surface that is a non-smooth surface of a device-related part having non-smooth surface, and has little trouble caused by adhesive aggregation products. The dicing sheet (1) is provided with a substrate (2) and an adhesive layer (3) that is laminated on at least one surface of the substrate (2), wherein: the adhesive layer (3) is formed of an adhesive composition containing an acrylic polymer (A) and an energy ray-polymerizable compound (B); the thickness of the adhesive layer (3) is not more than 25 mum; before energy ray irradiation, the storage elastic modulus of the adhesive layer (3) at 23°C is not more than 0.12 MPa; and, in a test for measuring the holding power of the adhesive layer (3) before energy ray irradiation, said test being conducted in accordance with JIS Z0237:2009, the holding time is 15,000 sec or longer. Also provided is a method for manufacturing a device chip using the dicing sheet (1).</p> |
