| 摘要 |
An overmolded pressure sensor package (200, 500, 600, 700, 800) is provided. The pressure sensor die (Pcell) (240, 640, 750, 850) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant (410, 510, 670, 780, 880). The Pcell cap (310, 640, 740, 840) includes a hole (330, 650, 745, 845) located away from the Pcell diaphragm (250, 635, 755, 855), so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer (310, 740) or a functional ASIC (640, 840). |
