Method for flip-chip assembly of two electronic components

摘要

The method involves aligning conductor inserts (12) of interconnection protuberances (22). Height (H) of wedges (24) is determined, so that the height is greater than that of the inserts when components are assembled. A contact surface of the wedges is determined, so that stress generated in the protuberances by force equal to a ratio of the force and addition of a contact surface of the protuberances and the surface is less than or equal to elastic limit. Constant force is applied to penetrate the inserts in the protuberances until an assembly contact is obtained between the wedges.