发明名称
摘要 A system for reinforcing a substrate includes a rotary device, a first guide connected to the rotary device, and a form positioned against the first guide. A reinforcement is supplied to wind around the form and against the first guide. A method for reinforcing a substrate includes connecting a first guide to a rotary device and positioning a form on a first side of the first guide. The method further includes winding a reinforcement around the form and against the first side of the first guide.
申请公布号 JP5410554(B2) 申请公布日期 2014.02.05
申请号 JP20120004727 申请日期 2012.01.13
申请人 发明人
分类号 E04C5/07 主分类号 E04C5/07
代理机构 代理人
主权项
地址