SOLDER BALL MOUNTING APPARATUS USING GRAVITY, SOLDER BALL MOUNTING SYSTEM AND METHOD FOR MOUNTING SOLDER BALL USING THE SAME

摘要

A solder ball mounting method according to the present invention includes the following steps of: (A) arranging a printed circuit board in order to mount solder balls; (B) positioning the printed circuit board between a table of a solder ball mounting apparatus and a mask for mounting; (C) supplying multiple solder balls to the mask for mounting, generating a vibration to the table of the solder ball mounting apparatus by the control of a control unit, and respectively tilting the table in a left and right direction at an acute angle; (D) determining whether the control unit fills opening parts of the mask for mounting with the solder balls or not; and (E) generating a vibration to the table and repetitively tilting the table again in the left and right direction respectively at an acute angle by the control unit depending on the determination result. [Reference numerals] (400) Control unit; (500) Display unit