METHOD OF MANUFACTURING CHIP INDUCTOR

摘要

The present invention relates to a method for manufacturing a chip inductor. In the method for manufacturing the chip inductor, an insulation layer and a circuit pattern are formed on a base substrate to improve yield and productivity and to reduce manufacturing costs. Suggested is the method for manufacturing the chip inductor, which includes the steps of: (a) preparing the base substrate wound around a main winding roll; (b) transferring the base substrate to an apparatus for processing the insulation layer and the circuit pattern by rotating the main winding roll; and (c) rewinding the base substrate with one side on which the insulation layer and the circuit pattern are formed by the (b) step around the main winding roll. [Reference numerals] (AA) Start; (BB) End; (S10) Prepare and wind a base substrate; (S20) Form an insulation layer; (S30) Deposit a seed layer; (S40) Exposure, Development; (S50) Form an electrolytic plating layer; (S60) Remove a dry film and the seed layer; (S70) Wind the base substrate