| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device requiring less space for installation and capable of grinding a large plate-like object. SOLUTION: A chuck table 70 for sucking and holding a wafer W is provided to each side-surface 62 of a quadratic prism-like rotary holding body 60, and the rotary holding body 60 is intermittently rotated in increments of 90°. The positions of the three side-surfaces 62 when the rotary holding body is stopped to rotate are set to the rough grinding position, the finish grinding position, and the polishing position, and a grinding means for rough grinding 80A, a grinding means for finish grinding 80B, and a grinding means for polishing 80C are disposed so as to face these machining positions, respectively. The wafers W sucked and held on the chuck table 70 at the loading/unloading positions are sequentially set to the respective machining positions by rotating the rotary holding body 60, and the wafers are rough ground, finish ground, and polished at these respective machining positions. The space for installation of the grinding device can be saved by three-dimensionally holding the plurality of wafers W by the quadratic prism-like rotary holding body 60. COPYRIGHT: (C)2011,JPO&INPIT |
