CHIP ON METAL TYPE HEAT RADIATING PRINTED CIRCUIT BOARD AND MANUFACTURING THE SAME

摘要

The present invention relates to a method for manufacturing a chip on metal type printed circuit board and more specifically, a method for manufacturing a chip on metal type printed circuit board which is an insulation layer formed on the surface of a metal plate by being separated from an LED heating element mounted on the surface of the metal plate; which forms a copper foil layer coated with hardened and semi hardened epoxy insulation resins without using FR4; and which is manufactured in a high temperature and high pressure chamber by being thermo-compressed on the metal plate.