摘要 |
Metal foil provided with an electrically resistive layer, characterized in that an alloy (in particular, a NiCrAlSi alloy) resistive layer containing 1 to 6 mass% of Si is formed on the metal foil controlled to have a ten-point average roughness Rz, which was measured by an optical method, of 4.0 to 6.0 µm, and the variation in the resistance value of the electrically resistive layer is within ±10%. Provided is a copper foil that allows embedding of a resistive material in a board by further forming an electrically resistive layer on the copper foil, and further allows improving the adhesiveness and suppressing the variation in resistance value within a certain range. As needed, metal foil provided in advance with a copper-zinc alloy layer formed on the surface thereof and a stabilizing layer composed of at least one component selected from zinc oxide, chromium oxide, and nickel oxide formed on the copper-zinc alloy layer is used. |