| 摘要 |
A surface-mount package structure (10) for reducing the ingress of moisture and gases thereto is disclosed. The surface-mount structure (10) includes a sub-module (14) having a dielectric layer (30), semiconductor devices (12) attached to the dielectric layer (30), a first level interconnect structure (28) electrically coupled to the semiconductor devices (12), and a second level I/O connection (16) electrically coupled to the first level interconnect (38) and formed on the dielectric layer (30), with the second level I/O connection (16) configured to connect the sub-module (14) to an external circuit. The semiconductor devices (12) of the sub-module (14) are attached to a substrate structure (18), with a dielectric material (26) positioned between the dielectric layer (30) and the substrate structure (18) to fill in gaps in the surface-mount structure (10). A diffusion barrier layer (28) is applied over the sub-module (14), adjacent the first and second level I/O connections (38,16), and extends down to the substrate structure (18) to reduce the ingress of moisture and gases from a surrounding environment into the surface-mount structure (10). |
