| 摘要 |
According to the present invention, a semiconductor wafer mounting method includes supplying a gas from a space between the inner edge of a ring frame and the outer edge of a semiconductor wafer to a gas supply part, flowing the gas between a bonding tape facing the back side of the semiconductor wafer and the semiconductor wafer, and bonding the bonding tape to the back side of the semiconductor wafer by roll-moving a bonding roller on the bonding tape separated from the back side of the semiconductor by the gas with a constant distance. [Reference numerals] (32) Pressure pump; (55) Control part |
