| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which a probe for electrical inspection can be properly contacted to a semiconductor element connection pad, an electrode of a semiconductor element can be properly connected to the semiconductor element connection pad, and a wiring conductor tightly fits to a resin layer for protection, with both of them effectively prevented from peeling from each other. SOLUTION: In the wiring board, a wiring conductor 3 containing a plurality of semiconductor element connection pads 6 is embedded into the upper surface of an insulation substrate 1, and a resin layer 4 for exposing the semiconductor element connection pad 6 and an insulation substrate 1 arranged therearound is coated on the upper surface on the insulation substrate 1 and on the wiring conductor 3. The wiring conductor 3 is coated on the surface of the insulation substrate 1 side of the resin layer 4 by a semi-additive method. A part of the resin layer 4 and an insulating layer 2 arranged thereunder are removed down to a position lower than the upper surface of the semiconductor element connection pad 6, so that the semiconductor element connection pad 6 and the insulation substrate 1 arranged therearound are exposed. COPYRIGHT: (C)2012,JPO&INPIT |
