发明名称 |
Computer modules with small thicknesses and associated methods of manufacturing |
摘要 |
Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture. |
申请公布号 |
US8644030(B2) |
申请公布日期 |
2014.02.04 |
申请号 |
US20090353773 |
申请日期 |
2009.01.14 |
申请人 |
GIBBONS KEVIN;REYNOLDS TRACY V.;CORISIS DAVID J.;MICRON TECHNOLOGY, INC. |
发明人 |
GIBBONS KEVIN;REYNOLDS TRACY V.;CORISIS DAVID J. |
分类号 |
H05K1/18;H01L25/065 |
主分类号 |
H05K1/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|