发明名称 |
Securing mechanism and method for wafer bonder |
摘要 |
Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer. |
申请公布号 |
US8640755(B2) |
申请公布日期 |
2014.02.04 |
申请号 |
US20100898643 |
申请日期 |
2010.10.05 |
申请人 |
CANALE STEVE;ZAPP DAVID J.;SKYWORKS SOLUTIONS, INC. |
发明人 |
CANALE STEVE;ZAPP DAVID J. |
分类号 |
B32B37/00 |
主分类号 |
B32B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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