发明名称 Multi-chip package and method of operating the same
摘要 A semiconductor memory device includes a memory cell array including first memory cells for storing data and second memory cells for storing chip identification (ID) information, a data comparison circuit configured to compare input data and the stored data of the first memory cells and to output comparison data, and output circuits configured to output the comparison data received in parallel from the data comparison circuit. The comparison data is outputted through a selected one of the output circuits according to an enable signal generated based on the chip ID information.
申请公布号 US8644092(B2) 申请公布日期 2014.02.04
申请号 US201113243223 申请日期 2011.09.23
申请人 KIM KYOUNG NAM;SHIN BEOM JU;HYNIX SEMICONDUCTOR INC. 发明人 KIM KYOUNG NAM;SHIN BEOM JU
分类号 G11C7/06 主分类号 G11C7/06
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