| 发明名称 |
Method of manufacturing electronic device on leadframe |
| 摘要 |
An electronic device and method of manufacturing. One embodiment includes attaching a first semiconductor chip to a first metallic clip. The first semiconductor chip is placed over a leadframe after the attachment of the first semiconductor chip to the first metallic clip. |
| 申请公布号 |
US8642394(B2) |
申请公布日期 |
2014.02.04 |
| 申请号 |
US20080020821 |
申请日期 |
2008.01.28 |
| 申请人 |
MOHAMED ABDUL RAHMAN;DORAISAMY STANLEY JOB;TAN TIEN LAI;OTREMBA RALF;INFINEON TECHNOLOGIES AG |
发明人 |
MOHAMED ABDUL RAHMAN;DORAISAMY STANLEY JOB;TAN TIEN LAI;OTREMBA RALF |
| 分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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